Method of forming a p-type layer for a light emitting device

ABSTRACT

In a method according to embodiments of the invention, a semiconductor structure including a III-nitride light emitting layer disposed between a p-type region and an n-type region is grown. The p-type region is buried within the semiconductor structure. A trench is formed in the semiconductor structure. The trench exposes the p-type region. After forming the trench, the semiconductor structure is annealed.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 15/592,658, filed on May 11, 2017, which claims priority toU.S. Provisional Patent Application No. 62/339,448, filed May 20, 2016and European Patent Application No. 16179661.0, filed Jul. 15, 2016, theentire disclosures of which are hereby incorporated by reference herein.

BACKGROUND

Semiconductor light-emitting devices including light emitting diodes(LEDs), resonant cavity light emitting diodes (RCLEDs), vertical cavitylaser diodes (VCSELs), and edge emitting lasers are among the mostefficient light sources currently available. Materials systems currentlyof interest in the manufacture of high-brightness light emitting devicescapable of operation across the visible spectrum include Group III-Vsemiconductors, particularly binary, ternary, and quaternary alloys ofgallium, aluminum, indium, and nitrogen, also referred to as III-nitridematerials. Typically, III-nitride light emitting devices are fabricatedby epitaxially growing a stack of semiconductor layers of differentcompositions and dopant concentrations on a sapphire, silicon carbide,III-nitride, or other suitable substrate by metal-organic chemical vapordeposition (MOCVD), molecular beam epitaxy (MBE), or other epitaxialtechniques. The stack often includes one or more n-type layers dopedwith, for example, Si, formed over the substrate, one or more lightemitting layers in an active region formed over the n-type layer orlayers, and one or more p-type layers doped with, for example, Mg,formed over the active region. Electrical contacts are formed on the n-and p-type regions.

In commercial III-nitride LEDs, the semiconductor structure is typicallygrown by MOCVD. The nitrogen source used during MOCVD is typicallyammonia. When ammonia dissociates, hydrogen is produced. The hydrogenforms a complex with magnesium, which is used as the p-type dopantduring growth of p-type materials. The hydrogen complex deactivates thep-type character of the magnesium, effectively reducing the dopantconcentration of the p-type material, which reduces the efficiency ofthe device. After growth of the p-type material, the structure isannealed in order to break the hydrogen-magnesium complex by driving offthe hydrogen.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a portion of a semiconductor structure including aburied p-type region and trenches for activating the p-type region.

FIG. 2 illustrates a portion of the top surface of the structureillustrated in FIG. 1.

FIG. 3 is a method of forming a device with a buried p-type region,according to some embodiments of the invention.

FIG. 4 illustrates an LED with a p-type region grown before the n-typeregion, according to some embodiments of the invention.

FIG. 5 illustrates an LED including a tunnel junction, according to someembodiments of the invention.

FIG. 6 illustrates a device including two LEDs separated by a tunneljunction, according to some embodiments of the invention.

FIG. 7 illustrates a portion of a partially-grown semiconductor device,including segments of mask material.

FIG. 8 illustrates a portion of a semiconductor device with embeddedtrenches.

FIG. 9 illustrates a portion of a semiconductor device including atrench in which a metal contact is disposed.

DETAILED DESCRIPTION

The requirement of an anneal in a hydrogen-free atmosphere to activatethe p-type layers in a III-nitride device limits device design. It hasbeen demonstrated experimentally that hydrogen cannot diffuse throughn-type III-nitride materials, and the hydrogen does not readily diffuselaterally through semiconductor material over distances corresponding tohalf the diameter of a typical device wafer. As a result, in order forthe activation anneal to be effective, the p-type layers cannot becovered by any other layer. Without an effective anneal, the device isleft without a p-type layer, or with a p-type layer with an extremelylow dopant concentration, rendering it useless. Accordingly, a devicewith a buried p-type layer, such as a device with a tunnel junction or adevice where the p-type layers are grown before the n-type layers,cannot be formed by a convention process including growth by MOCVDfollowed by annealing.

In embodiments of the invention, a device structure is grown with aburied p-type layer. Trenches are formed in the device structure thatexpose portions of the buried p-type layer. The structure is thenannealed, such that hydrogen can diffuse laterally out of the buriedp-type layer to the trenches, where the hydrogen can escape to theambient.

FIG. 1 illustrates a portion of a semiconductor device structure. Thestructure of FIG. 1 is grown on a growth substrate 30, which may be, forexample, sapphire, SiC, Si, a non-III-nitride material, GaN, a compositesubstrate, or any other suitable substrate. An optional III-nitride film102 may be grown before p-type region 100, though III-nitride film 102is not required. III-nitride film 102 may include, for example,nucleation or buffer layers, smoothing layers that may be GaN or anyother III-nitride material, n-type layers, light emitting or activelayers, undoped layers, the active region of a device, and/or any othersuitable layers or materials.

The p-type region 100 includes at least one binary, ternary, quaternary,or quinary III-nitride layer that is doped with a p-type dopant such as,for example, Mg or any other suitable material.

A III-nitride film 104 is grown after the p-type layer 100 such that thep-type layer 100 is buried by the III-nitride film 104. III-nitride film104 may include n-type layers, p-type layers, the active region of adevice, light emitting layers, undoped layers, and/or any other suitablelayers or materials.

After or during growth, trenches 106 are formed in the semiconductorstructure. Trenches 106 may extend through the entire thickness ofIII-nitride film 104 such that the bottoms of trenches 106 are in p-typeregion 100, as illustrated in FIG. 1. Alternatively, trenches 106 mayextend through the entire thicknesses of both III-nitride film 104 andp-type region 100 such that the bottoms of trenches 106 are inIII-nitride film 102, are the surface of growth substrate 30, or extendinto growth substrate 30.

The width 108 of trenches 106 may be, for example, at least 0.05 μm insome embodiments, no more than 50 μm in some embodiments, at least 0.5μm in some embodiments, and no more than 15 μm in some embodiments. Insome embodiments, the trenches are kept as small as possible to avoidlosing light-emitting area.

Trenches 106 are spaced such that all of the p-type region 100 is spaceda distance from a trench that is no more than the maximum diffusionlength of hydrogen during the later anneal. The maximum spacing 110between trenches 106 may be twice the average or maximum diffusionlength of hydrogen during the anneal. The spacing 110 may be determinedby the conditions of the anneal, which may determine the maximum lateraldiffusion length of hydrogen during the anneal—different anneals mayhave different maximum lateral diffusion lengths. The maximum spacing110 between nearest neighbor trenches may be at least 1 μm in someembodiments, no more than 500 μm in some embodiments, at least 5 μm insome embodiments, and no more than 250 μm in some embodiments.

The semiconductor structure illustrated in FIG. 1 may be annealed afterforming trenches 106. During the anneal, hydrogen is driven out ofp-type region 100 into trenches 106, where it can escape from thesemiconductor structure into the ambient.

In some embodiments, after annealing, trenches 106 may be filled with aninsulating material 114. Insulating material 114 permits a metal contactto be formed on a surface with trenches, without inadvertently causing ashort. Insulating material 114 may be formed at any stage of processingafter the anneal—for example, trenches 106 may be filled with insulatingmaterial 114 before or after removing the growth substrate, inembodiments where the growth substrate is removed, or before or afteretching to expose a buried layer, in embodiments where such etching isperformed.

In some embodiments, trenches 106 are used as vias in which metalcontacts are formed, to contact the p-type region in a p-side downdevice, as illustrated in FIG. 9. In embodiments where metal contacts134 are formed in trenches 106 in contact with the p-type region 100, asequence of metals and insulators are deposited and patterned such thatthe metal contact is in direct contact with only the buried p-typeregion 100 or other desired layer (in the bottom of the trench 132 asillustrated in FIG. 9), and not the layers above (III-nitride film 104).For example, an insulating material 130 may be disposed on the sidewallsof the trench between the contact metal 134 and the semiconductor layersthat are not to be in direct contact with the metal contact.

In some embodiments, trenches 106 are left exposed to air or ambientgas, or coated with a thin passivation layer (SiO₂ for example) ratherthan filled. Accordingly, in some embodiments, trenches 106 may bepartially or completely filled with an insulating or passivatingmaterial.

FIG. 2 is a plan view of a portion of a top surface 112 of the structureof FIG. 1. As illustrated in FIG. 2, in some embodiments, trenches 106may be isolated from each other, and surrounded by a portion of thesemiconductor structure that is uninterrupted by a trench. Accordingly,in some embodiments, the semiconductor material is all electricallyconnected, and no electrically isolated islands of semiconductormaterial are formed by trenches 106. In some embodiments, some or alltrenches may connect to each other to form isolated islands ofsemiconductor material—for example, in some embodiments, trenches 106may define the boundaries of a single device that is later separatedfrom a wafer of semiconductor material. A single device formed on awafer of devices may have some trenches that connect to each other todefine the boundaries of the device or an isolated island ofsemiconductor material within the device, and one or more other trenchesthat are isolated from each other and formed within the isolated islandof semiconductor material.

FIG. 3 illustrates a method of forming a device. In block 120, aIII-nitride structure with a buried p-type region is grown on a growthsubstrate.

In block 122, trenches 106 are formed in the grown III-nitridestructure. Trenches 106 are illustrated in FIGS. 1 and 2. Trenches 106may be formed by any suitable technique, including for example, dryetching, wet etching, or a combination of dry and wet etching. In someembodiments, the method of forming the trench may influence thediffusion of hydrogen out of the exposed surface of semiconductormaterial formed by etching the trench.

For example, p-type GaN is known to convert to n-type GaN during dryetching. If the thickness of the surface of the p-type that converts ton-type is too great, the diffusion of hydrogen may be blocked such thathydrogen builds up at the type-converted surface and cannot escape.Accordingly, in some embodiments, after dry etching to form the trenches106, the surface of the trenches may be cleaned with a wet etch toremove the n-type converted layer or to reduce the thickness of then-type converted layer to a thickness through which hydrogen readilydiffuses.

In some embodiments, the semiconductor structure may be selectivelygrown to form trenches during growth, as illustrated in FIGS. 7 and 8.For example, as illustrated in FIG. 7, an optional III-nitride film 102and a p-type region 100 are grown over a substrate 30. A mask material120 such as SiO₂ may be disposed on the p-type region 100, thenpatterned such that the mask material is left in areas where trenchesare formed. The mask material is not limited to the location illustratedin FIG. 7. For example, in various embodiments, the mask material isformed directly on the growth substrate, on a surface of partially grownIII-nitride film 102, on the surface of a fully grown III-nitride film102, on a surface of partially grown p-type region 100, or on thesurface of fully grown p-type region 100, as illustrated. The maskmaterial may be formed in any layer of the device, on any surface(including directly on growth substrate 30), with any thickness, and mayextend through multiple layers, as long as the mask material is indirect contact with at least a portion of p-type region 100.

III-nitride film 104 is grown over the mask material 120. Growth willeventually cover the mask material via lateral overgrowth, such thatareas 122 between neighboring mask regions are filled with III-nitridematerial, as illustrated in FIG. 8. When the die is singulated aftergrowth, a wet etch or other suitable technique may be used to remove themask material, creating an embedded trench 124 through which hydrogenmay escape during activation anneal. During the activation anneal,hydrogen escapes from the embedded trenches through the sides of thewafer, where the embedded trenches are exposed to the ambient.

Returning to FIG. 3, in block 124, the III-nitride structure withtrenches is annealed, in order to activate the buried p-type region, forexample by driving off hydrogen that has formed a complex with thep-type dopant in the p-type region.

FIGS. 4, 5, and 6 illustrate devices including a buried p-type regionwhich may be activated by forming trenches and annealing, as illustratedin FIGS. 1, 2, and 3. FIG. 4 illustrates a device where the p-typeregion is grown before the n-type region. FIGS. 5 and 6 illustratedevices including tunnel junctions. The trenches are omitted from FIGS.4, 5, and 6 for clarity. In particular, the devices illustrated in FIGS.4, 5, and 6 may be, for example, on the order of 1 mm on a side, meaningthat tens or even hundreds of trenches may be formed in a single device.In any of the devices illustrated in FIGS. 4, 5, and 6, one or more ofthe trenches may be used as vias in which metal contacts to the buriedlayers of the device are disposed, as described above.

In some embodiments, the p-type region of a III-nitride device is grownbefore the light emitting layer and the n-type region.

In conventional III-nitride LEDs, the n-type region is grown first on asubstrate, followed by the light emitting layers and the p-typesemiconductor. The internal field of a III-nitride LED grown n-side downincreases with increasing forward bias. As a result, as the device bias(current) is increased, the internal electric field increases, reducingelectron-hole overlap and thereby reducing radiative efficiency. Growingthe device in the reverse order, with the p-type region grown first onthe substrate, reverses the internal field. In a III-nitride LED grownp-side down, the internal field is opposite the built-in polarizationfield. As a result, as the forward bias (current) increases, theradiative efficiency of such a device may increase.

FIG. 4 illustrates one example of a device where the p-type region isgrown before the light emitting layer and the n-type region. Such asemiconductor structure may be incorporated into any suitable device;embodiments of the invention are not limited to the vertical deviceillustrated. In embodiments where the original growth substrate isremoved, such as, for example, a flip chip device, structure 102 may betotally removed to make electrical contact to the p-type region, or ahole/trench may be etched through structure 102 to expose a portion ofthe p-type region on which a metal contact may be formed. In embodimentswhere the substrate remains, such as, for example, a lateral die device,one contact may be disposed on the top surface of the semiconductorstructure, and the other contact may be disposed on a surface exposed byetching to expose the p-type region.

The device illustrated in FIG. 4 includes a semiconductor structure 10grown on a growth substrate (not shown). The p-type region 12 is grownfirst, followed by an active or light emitting region including at leastone light emitting layer 14, followed by an n-type region 16.

P-type region 12 corresponds to buried p-type region 100 of FIG. 1;active region 14 and n-type region 16 correspond to III-nitride film 104of FIG. 1; III-nitride film 102 of FIG. 1 may be a nucleation or bufferstructure (not shown) or may be omitted.

A metal p-contact 18 is disposed on the p-type region 12; a metaln-contact 20 is disposed on the n-type region 16.

The semiconductor structure 10 includes a light emitting or activeregion sandwiched between n- and p-type regions. The n-type region 16may include multiple layers of different compositions and dopantconcentration including, for example, n- or even p-type device layersdesigned for particular optical, material, or electrical propertiesdesirable for the light emitting region to efficiently emit light. Thelight emitting layer 14 may be included in a light emitting or activeregion. Examples of suitable light emitting regions include a singlethick or thin light emitting layer, or a multiple quantum well lightemitting region including multiple thin or thick light emitting layersseparated by barrier layers. The p-type region 12 may include multiplelayers of different composition, thickness, and dopant concentration,including preparation layers such as buffer layers or nucleation layers,and/or layers designed to facilitate removal of the growth substrate,which may be p-type, n-type, or not intentionally doped, and layers thatare not intentionally doped, or n-type layers.

After growth, the semiconductor structure may be processed into anysuitable device.

In some embodiments, a III-nitride device includes a tunnel junction. Atunnel junction (TJ) is a structure that allows electrons to tunnel fromthe valence band of a p-type layer to the conduction band of an n-typelayer in reverse bias. When an electron tunnels, a hole is left behindin the p-type layer, such that carriers are generated in both layers.Accordingly, in an electronic device like a diode, where only a smallleakage current flows in reverse bias, a large current can be carried inreverse bias across a tunnel junction. A tunnel junction requires aparticular alignment of the conduction and valence bands at the p/ntunnel junction, which has typically been achieved in other materialssystems using very high doping (e.g. p++/n++ junction in the (Al)GaAsmaterial system). III-nitride materials have an inherent polarizationthat creates an electric field at heterointerfaces between differentalloy compositions. This polarization field can be utilized to achievethe required band alignment for tunneling.

FIGS. 5 and 6 illustrate two devices including tunnel junctions.

In the device of FIG. 5, a tunnel junction is disposed between thep-type region and the metal contact that injects current into the p-typeregion. The contact may be formed on an n-type layer, which may havemuch better sheet resistance and hence better current spreading ascompared to p-type layers. In the device illustrated in FIG. 5, n-typelayers are used as contact layers for both the positive and negativeterminals of the LED, by converting holes from the p-type region intoelectrons in an n-type contact layer via a tunnel junction.

The device of FIG. 5 includes an n-type region 32 grown on a growthsubstrate, followed by a light emitting layer 34, which may be disposedin a light emitting region, and a p-type region 36. The n-type region32, light emitting layer 34, and p-type region 36 are described above inthe text accompanying FIG. 4. A tunnel junction 38 is formed over thep-type region 36.

In some embodiments, tunnel junction 38 includes a highly doped p-typelayer, also referred to as a p++ layer, in direct contact with p-typeregion 36, and a highly doped n-type layer, also referred to as an n++layer, in direct contact with the p++ layer. (In some embodiments, thep++ layer of tunnel junction 38 may serve as the p-type region in thedevice, such that a separate p-type region is not required.) In someembodiments, tunnel junction 38 includes a layer of a compositiondifferent from the p++ layer and the n++ layer sandwiched between thep++ layer and the n++ layer. In some embodiments, tunnel junction 38includes an InGaN layer sandwiched between the p++ layer and the n++layer. In some embodiments, tunnel junction 38 includes an MN layersandwiched between the p++ layer and the n++ layer. The tunnel junction38 is in direct contact with n-type layer 40, described below.

The p++ layer may be, for example, InGaN or GaN, doped with an acceptorsuch as Mg or Zn to a concentration of about 10¹⁸ cm⁻³ to about 5×10²⁰cm⁻³. In some embodiments, the p++ layer is doped to a concentration ofabout 2×10²⁰ cm⁻³ to about 4×10²⁰ cm⁻³. The n++ layer may be, forexample, InGaN or GaN, doped with an acceptor such as Si or Ge to aconcentration of about 10¹⁸ cm⁻³ to about 5×10²⁰ cm⁻³. In someembodiments, the n++ layer is doped to a concentration of about 7×10¹⁹cm⁻³ to about 9×10¹⁹ cm⁻³. Tunnel junction 38 is usually very thin, forexample tunnel junction 38 may have a total thickness ranging from about2 nm to about 100 nm, and each of the p++ layer and the n++ layer mayhave a thickness ranging from about 1 nm to about 50 nm. In someembodiments, each of the p++ layer and the n++ layer may have athickness ranging from about 25 nm to about 35 nm. The p++ layer and then++ layer may not necessarily be the same thickness. In one embodiment,the p++ layer is 15 nm of Mg-doped InGaN and the n++ layer is 30 nm ofSi-doped GaN. The p++ layer and the n++ layer may have a graded dopantconcentration. For example, a portion of the p++ layer adjacent to theunderlying p-type region 36 may have a dopant concentration that isgraded from the dopant concentration of the underlying p-type region tothe desired dopant concentration in the p++ layer. Similarly, the n++layer may have a dopant concentration that is graded from a maximumadjacent to the p++ layer to a minimum adjacent to the n-type layer 40formed over the tunnel junction 38. Tunnel junction 38 is fabricated tobe thin enough and doped enough such that tunnel junction 38 displayslow series voltage drop when conducting current in reverse-biased mode.In some embodiments, the voltage drop across tunnel junction 38 is about0.1V to about 1V.

Embodiments including an InGaN or MN or other suitable layer between thep++ layer and the n++ layer may leverage the polarization field inIII-nitrides to help align the bands for tunneling. This polarizationeffect may reduce the doping requirement in the n++ and p++ layers andreduce the tunneling distance required (potentially allowing highercurrent flow). The composition of the layer between the p++ layer andthe n++ layer may be different from the composition of the p++ layer andthe n++ layer, and/or may be selected to cause band re-alignment due tothe polarization charge that exists between dissimilar materials in theIII-nitride material system.

Examples of suitable tunnel junctions are described in U.S. Pat. No.8,039,352 B2, which is incorporated herein by reference.

An n-type contact layer 40 is formed over tunnel junction 38, in directcontact with the n++ layer.

In the device of FIG. 5, p-type region 36 and the p++ layer of tunneljunction 38 correspond to the p-type region 100 of FIG. 1; the n++ layerof tunnel junction 38 and n-type contact layer 40 correspond toIII-nitride film 104 of FIG. 1; the n-type region 32 and active region34 correspond to III-nitride film 102 of FIG. 1.

First and second metal contacts 44 and 42 are formed on the n-typecontact layer 40, and on the n-type region 32, respectively. A mesa maybe etched to form a flip chip device, as illustrated in FIG. 5, or anyother suitable device structure may be used. The first and second metalcontacts 44 and 42 may be the same material, such as aluminum, thoughthis is not required; any suitable contact metal or metals may be used.

In the device of FIG. 6, multiple LEDs are grown on top of one anotherand connected in series via a tunnel junction. In the device of FIG. 6,multiple LEDs are created within the footprint of a single LED, whichmay dramatically increase the optical flux generated per unit area. Inaddition, by driving the LEDs connected by a tunnel junction at a lowerdrive current, each LED can operate at its peak efficiency. In a singleLED, this would result in a drop in light output, however by having twoor more LEDs connected in series in a given chip area, the light outputcan be maintained while efficiency is dramatically improved. Thus, thetunnel junction device illustrated in FIG. 6 may be used in applicationsthat require high efficiency and/or applications that require high fluxper unit area.

The device of FIG. 6 includes an n-type region 32 grown on a growthsubstrate, followed by a light emitting layer 34, which may be disposedin a light emitting region, and a p-type region 36 (as described above,the p++ layer of the tunnel junction may function as p-type region 36,such that a separate p-type region is not required). The n-type region32, light emitting layer 34, and p-type region 36 are described above inthe text accompanying FIG. 4. A tunnel junction 38, as described above,is formed over the p-type region 36. A second device structure,including a second n-type region 46, a second light emitting layer 48,and a second p-type region 50 are formed over tunnel junction 38. Thetunnel junction 38 is oriented such that the p++ layer is in directcontact with the p-type region 36 of the first LED, and the n++ layer isin direct contact with the n-type region 46 of the second LED.

In the device of FIG. 6, p-type region 36 and the p++ layer of tunneljunction 38 correspond to the p-type region 100 of FIG. 1; the n++ layerof tunnel junction 38, n-type layer 46, active region 48, and p-typeregion 50 correspond to III-nitride film 104 of FIG. 1 (if the trenchesare in direct contact with p-type region 50, the trenches will alsoactivate p-type region 50, though p-type region 50, if it is the lastgrown layer, may also be activated by a conventional anneal); the n-typeregion 32 and active region 34 correspond to III-nitride film 102 ofFIG. 1.

First and second metal contacts 54 and 52 are formed on the n-typeregion 32 of the first LED, and on the p-type region 50 of the secondLED, respectively. A mesa may be etched to form a flip chip device, asillustrated in FIG. 6, or any other suitable device structure may beused. In some embodiments, an additional tunnel junction and n-typelayer may be formed over the p-type region 50 of the second LED, inorder to form the second metal contact 52 on an n-type layer, asillustrated in the device of FIG. 5.

Though two active regions are illustrated in FIG. 6, any number ofactive regions may be included between the two metal contactsillustrated, provided the p-type region adjacent each active region isseparated from the n-type region adjacent the next active region by atunnel junction. Since the device of FIG. 6 has only two contacts, bothlight emitting layers emit light at the same time and cannot beindividually and separately activated. In other embodiments, individualLEDs in the stack may be separately activated by forming additionalcontacts. In some embodiments, a device may have enough junctions suchthat the device can operate at a typical line voltage such as, forexample, 110 volts, 220 volts, etc.

The two light emitting layers may be fabricated with the samecomposition, such that they emit the same color light, or with differentcompositions, such that they emit different colors (i.e. different peakwavelengths) of light. For example, a three active region device withtwo contacts may be fabricated such that the first active region emitsred light, the second active region emits blue light, and the thirdactive region emits green light. When activated, the device may producewhite light. Since the active regions are stacked such that they appearto emit light from the same area, such devices may avoid problems withcolor mixing present in a device that combines red, blue, and greenlight from adjacent, rather than stacked, active regions. In a devicewith active regions emitting different wavelengths of light, the activeregion that generates light of the shortest wavelength may be locatedclosest to the surface from which light is extracted, generally thesapphire, SiC, or GaN growth substrate in an LED. Placement of theshortest wavelength active region near the output surface may minimizeloss due to absorption in the quantum wells of the other active regionsand may reduce the thermal impact on more sensitive longer wavelengthquantum wells by locating the longer wavelength active regions closer tothe heat sink formed by the contacts. The quantum well layers may alsobe made sufficiently thin that absorption of light in the quantum welllayers is low. The color of the mixed light emitted from the device maybe controlled by selecting the number of active regions that emit lightof each color. For example, the human eye is very sensitive to greenphotons and not as sensitive to red photons and blue photons. In orderto create balanced white light, a stacked active region device may havea single green active region and multiple blue and red active regions.

The devices of FIGS. 4, 5, and 6 are formed by growing a III-nitridesemiconductor structure on a growth substrate 30 as is known in the art.The growth substrate is often sapphire but may be any suitable substratesuch as, for example, SiC, Si, GaN, or a composite substrate (such as,for example, GaN on a sapphire template). A surface of the growthsubstrate on which the III-nitride semiconductor structure is grown maybe patterned, roughened, or textured before growth, which may improvelight extraction from the device. A surface of the growth substrateopposite the growth surface (i.e. the surface through which a majorityof light is extracted in a flip chip configuration) may be patterned,roughened or textured before or after growth, which may improve lightextraction from the device.

The metal contacts often include multiple conductive layers such as areflective metal and a guard metal which may prevent or reduceelectromigration of the reflective metal. The reflective metal is oftensilver but any suitable material or materials may be used. The metalcontacts are electrically isolated from each other by a gap which may befilled with a dielectric such as an oxide of silicon or any othersuitable material. Multiple vias to expose portions of n-type region 32may be formed; the metal contacts are not limited to the arrangementsillustrated in FIGS. 4, 5, and 6. The metal contacts may beredistributed to form bond pads with a dielectric/metal stack, as isknown in the art.

In order to form electrical connections to the LED, one or moreinterconnects are formed on or electrically connected to the two metalcontacts illustrated. The interconnects may be, for example, solder,stud bumps, gold layers, or any other suitable structure.

The substrate 30 may be thinned or entirely removed. In someembodiments, the surface of substrate 30 exposed by thinning ispatterned, textured, or roughened to improve light extraction.

Any of the devices described herein may be combined with a wavelengthconverting structure. The wavelength converting structure may containone or more wavelength converting materials. The wavelength convertingstructure may be directly connected to the LED, disposed in closeproximity to the LED but not directly connected to the LED, or spacedapart from the LED. The wavelength converting structure may be anysuitable structure. The wavelength converting structure may be formedseparately from the LED, or formed in situ with the LED.

Examples of wavelength converting structures that are formed separatelyfrom the LED include ceramic wavelength converting structures, that maybe formed by sintering or any other suitable process; wavelengthconverting materials such as powder phosphors that are disposed intransparent material such as silicone or glass that is rolled, cast, orotherwise formed into a sheet, then singulated into individualwavelength converting structures; and wavelength converting materialssuch as powder phosphors that are disposed in a transparent materialsuch as silicone that is formed into a flexible sheet, which may belaminated or otherwise disposed over an LED.

Examples of wavelength converting structures that are formed in situinclude wavelength converting materials such as powder phosphors thatare mixed with a transparent material such as silicone and dispensed,screen printed, stenciled, molded, or otherwise disposed over the LED;and wavelength converting materials that are coated on the LED byelectrophoretic, vapor, or any other suitable type of deposition.

Multiple forms of wavelength converting structure can be used in asingle device. As just one example, a ceramic wavelength convertingmember can be combined with a molded wavelength converting member, withthe same or different wavelength converting materials in the ceramic andthe molded members.

The wavelength converting structure may include, for example,conventional phosphors, organic phosphors, quantum dots, organicsemiconductors, II-VI or III-V semiconductors, II-VI or III-Vsemiconductor quantum dots or nanocrystals, dyes, polymers, or othermaterials that luminesce.

The wavelength converting material absorbs light emitted by the LED andemits light of one or more different wavelengths. Unconverted lightemitted by the LED is often part of the final spectrum of lightextracted from the structure, though it need not be. Examples of commoncombinations include a blue-emitting LED combined with a yellow-emittingwavelength converting material, a blue-emitting LED combined with green-and red-emitting wavelength converting materials, a UV-emitting LEDcombined with blue- and yellow-emitting wavelength converting materials,and a UV-emitting LED combined with blue-, green-, and red-emittingwavelength converting materials. Wavelength converting materialsemitting other colors of light may be added to tailor the spectrum oflight extracted from the structure.

The embodiments described herein may be incorporated into any suitablelight emitting device. Embodiments of the invention are not limited tothe particular structures illustrated.

Some features of some embodiments may be omitted or implemented withother embodiments. The device elements and method elements describedherein may be interchangeable and used in or omitted from any of theexamples or embodiments described herein.

Though in the examples and embodiments described above the semiconductorlight emitting device is a III-nitride LED that emits blue or UV light,semiconductor light emitting devices besides LEDs, such as laser diodes,are within the scope of the invention. In addition, the principlesdescribed herein may be applicable to semiconductor light emitting orother devices made from other materials systems such as other III-Vmaterials, III-phosphide, III-arsenide, II-VI materials, ZnO, orSi-based materials.

Having described the invention in detail, those skilled in the art willappreciate that, given the present disclosure, modifications may be madeto the invention without departing from the spirit of the inventiveconcept described herein. Therefore, it is not intended that the scopeof the invention be limited to the specific embodiments illustrated anddescribed.

What is claimed is:
 1. A method for selectively growing a semiconductorstructure, the method comprising: forming a plurality of sections ofmask material on a surface of a semiconductor substrate, thesemiconductor substrate comprising at least one p-type region and atleast one n-type region on a growth substrate; growing a III-nitridefilm around the plurality of sections of mask material to form at leastone embedded trench, the mask material remaining in the at least oneembedded trench during growing of the III-nitride film, wherein theIII-nitride film is a III-nitride light emitting layer; and annealingthe semiconductor structure.
 2. The method of claim 1, wherein the maskmaterial comprises an insulating material.
 3. The method of claim 1,further comprising, prior to annealing the semiconductor structure,removing the plurality of sections of mask material to expose a surfaceof the at least one embedded trench.
 4. The method of claim 1, whereinthe at least one embedded trench is surrounded by portions of the p-typeregion that are uninterrupted by the at least one embedded trench. 5.The method of claim 1, wherein there are nearest neighbor trenches thatare spaced less than twice a maximum length of diffusion of hydrogenduring an annealing process.
 6. The method of claim 1, furthercomprising growing tunnel junctions on the p-type region.
 7. A methodfor selectively growing a semiconductor structure, the methodcomprising: forming a plurality of sections of mask material on asurface of a semiconductor substrate; growing a III-nitride film aroundthe plurality of sections of mask material to form at least one embeddedtrench, the mask material remaining in the at least one embedded trenchduring growing of the III-nitride film; and annealing the semiconductorstructure, wherein there are nearest neighbor trenches that are spacedless than twice a maximum length of diffusion of hydrogen during anannealing process.
 8. The method of claim 7, wherein the semiconductorstructure comprises at least one p-type region and at least one n-typeregion on the semiconductor substrate.
 9. The method of claim 8, whereinthe III-nitride film is a III-nitride light emitting layer.
 10. Themethod of claim 8, further comprising growing tunnel junctions on thep-type region.
 11. The method of claim 7, wherein the mask materialcomprises an insulating material.
 12. The method of claim 7, furthercomprising, prior to annealing the semiconductor structure, removing theplurality of sections of mask material to expose a surface of the atleast one embedded trench.